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The problem is DC electrical degradation. DC voltage is applied to the decoupling capacitor for the longest time; therefore, oxygen vacancies can be piled up at the interface between the perovskite-type dielectric and the reverse-biased electrode, resulting in the increase of leakage current.
Besides decoupling applications, there are other applications of thin film capacitor. Tunable capacitor is one of them.
Tunable capacitors are intended for use in RF tunable applications. This slide shows the plots of relative dielectric constant versus applied voltage. As shown in this slide, the voltages at which the relative dielectric constants have their maximum values were shifted toward the positive-bias region. The shift is increased with increasing the thickness of the oxygen-depleted layer in the range of oxygen-depleted layer thickness of 0 nm through 20 nm. This can be attributed to positively charged oxygen vacancies near the bottom electrodes. However the thickness of the oxygen-depleted layer exceeds 20 nm, the peak shift is saturated.
By the way, it is assumed that the voltage shift in the sample without intentionally inserted oxygen depleted layer is due to the native positively charged defects.
The problem on RF application is, a lag time for tuned capacitance to be settled after applying the bias. It takes considerable time for capacitance to be tuned.
Lag time results from the narrow depletion accompanied with the electron detrapping from the deep level.
This is a schematic which explain the narrow depletion accompanied with the electron detrapping from deep defect levels near the interface between (Ba,Sr)TiO3 and reverse-biased electrode. There are deep-level donors in a (Ba,Sr)TiO3 film with oxygen vacancies. The deep-level donors are ionized as a result of the lowering of quasi-Fermi level. Therefore, the density of the ionized donors increases and the depletion layer becomes narrower. Note that the depletion layer of some conventional semiconductors with a low purity also becomes narrower owing to the ionization of the deep-level donors.
Such a detrapping from deep levels causes a several seconds of lag time for tuned capacitance to be settled after applying the bias. It can be a disaster on RF applications.